技嘉特定AM5主板与AMD Ryzen 8000G系列搭配,可获得USB4功能

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发布时间:2024-01-08 09:26

此前 AMD 在 "Advancing AI" 活动上发布了代号为 "Hawk Point" 的 Ryzen 8040 系列移动处理器,沿用了台积电(TSMC)的 4nm 工艺,CPU 和 GPU 仍然为原来的 Zen 4 和 RDNA 3 架构,但 Ryzen AI 更名为 NPU,继续使用 XDNA 架构,提供了更强的算力。近期有消息称,接下来桌面平台也将迎来 Ryzen 8000G 系列 APU,支持 AM5 平台,搭配 DDR5 内存。

据 Benchlife报道,AMD Ryzen 8000G 系列 APU 不会特别强调支持数据传输速率 40 Gbps 的 USB4,但是已经有主板厂商打算针对 AM5 主板,提供 USB4 接口,比如技嘉的 AORUS B650E ELITE X AX ICE。用户使用 Ryzen 8000G 系列 APU,就能获得 USB4 功能。暂时还不确定华硕和微星等其他主板厂商,是否也会跟进这种做法。

USB4 是 USB-IF 在 2019 年 8 月公布的,主要是基于 Thunderbolt 3 协议规范所制定,使用了 Type-C 接口。2022 年,USB-IF 还推出 USB4 v2.0 规范,得益于 PAM3 信号编码机制的全新物理层架构,实现了最高 80 Gbps 的数据传输速率。

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' ) ; Table ( ) .init ( { title: " 历代 USB 版本 ", header: [ "USB 版本 "," 最大传输速度 "," 代号 "," 最大输出电流 " ] , width: '92%', columnWidth: 'MAX', // 表格单元宽度,"MAX" 最大内容显示,""AVG" 平均,"AUTO" 自动,指定 [ 15,16,20 ] id: tableid, data: [ [ "USB 1.0","1.5Mbps(0.192MB/s)","Low Speed","5V/500mA" ] , [ "USB 1.1","12Mbps(1.5MB/s)","Full Speed","5V/500mA" ] , [ "USB 2.0","480Mbps(60MB/s)","Hi-Speed","5V/500mA" ] , [ "USB 3.0","5Gbps(625MB/s)","SuperSpeed","5V/900mA" ] , [ "USB 3.1 ( Gen 1 ) ","5Gbps(625MB/s)","SuperSpeed","5V/900mA" ] , [ "USB 3.1 ( Gen 2 ) ","10Gbps(1250MB/s)","SuperSpeed+","20V/5A" ] , [ "USB 3.2 ( Gen 1 ) ","5Gbps(625MB/s)","SuperSpeed","5V/900mA" ] , [ "USB 3.2 ( Gen 2 ) ","10Gbps(1250MB/s)","SuperSpeed+","20V/5A" ] , [ "USB 3.2 ( Gen 2 × 2 ) ","20Gbps(2500MB/s)","SuperSpeed+","20V/5A" ] , [ "USB4 1.0","40Gbps(5000MB/s)"," 未知 ","48V/5A" ] , [ "USB4 2.0","80Gbps(10000MB/s)"," 未知 ","48V/5A" ] , ] } ) ;

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